• DocumentCode
    3183100
  • Title

    Waveguide to microstrip transitions in W-band with LTCC technology

  • Author

    Sun, Shichun ; Wang, Zhigang ; Yan, Bo ; Xu, Ruimin

  • Author_Institution
    Sch. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2009
  • fDate
    7-10 Dec. 2009
  • Firstpage
    2515
  • Lastpage
    2517
  • Abstract
    In this paper, two broadband rectangular waveguide to microstrip transitions at W-band with LTCC (low temperature co-fired ceramic) technology are proposed: WLWMT (WR-10 to LTCC waveguide to microstrip transition), and a novel probe transition of WR-10 to Microstrip using LTCC technology. To widen the bandwidth of WLWMT, two matching structures which are composed of stripline on different substrate layers connected by the staggered via side walls are buried. For the novel probe transition, inner conducting ground is used as waveguide backshort comparing with that in HIMCs (Hybrid Integrated Microwave Circuits). According to EM simulation, the WLWMT illustrates a 19% effective bandwidth (ranging from 91.6 to 98.2 GHz); the probe transition illustrates a 29% effective bandwidth (ranging from 90 to 100 GHz).
  • Keywords
    ceramics; microstrip transitions; rectangular waveguides; EM simulation; LTCC technology; W-band waveguide-microstrip transition; WLWMT bandwidth; WR-10; broadband rectangular waveguide; frequency 90 GHz to 100 GHz; inner conducting ground; low temperature cofired ceramic technology; probe transition; staggered via side walls; stripline; waveguide backshort; Bandwidth; Ceramics; Circuit simulation; Integrated circuit technology; Microstrip; Probes; Rectangular waveguides; Stripline; Temperature; Waveguide transitions; Ceramic; LTCC; W-band; prob; transition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2009. APMC 2009. Asia Pacific
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2801-4
  • Electronic_ISBN
    978-1-4244-2802-1
  • Type

    conf

  • DOI
    10.1109/APMC.2009.5385218
  • Filename
    5385218