DocumentCode
3183524
Title
Forced convection from a rectangular heat source in uniform shear flow: The conjugate Peclet number in the thin plate limit
Author
Li, Yiming ; Ortega, Alfonso
Author_Institution
Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA
fYear
1998
fDate
27-30 May 1998
Firstpage
284
Lastpage
294
Abstract
An analytical Green´s function method is used to formulate the solution to conjugate heat transfer from rectangular heat sources on thin conducting boards in boundary layer flow. The boundary layer flow is modeled by a uniform shear flow approximation. The Green´s functions, which are solutions to the temperature field that arises from a point heat source on the surface, provide a relationship between the local heat flux and surface temperature on the plate, effectively serving the same role as the heat transfer coefficient. The conjugate solution is found by coupling the pointwise Green´s function to a finite element discretization of the thin plate. An extensive parametric study was performed on the effects of Peclet number, board conductivity and thickness, and heat source geometry. A robust correlation for conjugate heat transfer is presented for the limit where the substrate plate can be considered to be thin. The correlation simultaneously accounts for the effects of convective heat transfer and conduction heat transfer into the plate through the use of a conjugate Peclet number defined for the thin plate limit
Keywords
Green´s function methods; boundary layers; cooling; finite element analysis; forced convection; heat conduction; printed circuits; shear flow; temperature distribution; thermal analysis; thermal conductivity; thermal management (packaging); Green´s functions; Peclet number; analytical Green´s function method; board conductivity; board thickness; boundary layer flow; boundary layer flow model; conduction heat transfer; conjugate Peclet number; conjugate heat transfer; conjugate heat transfer correlation; convective heat transfer; forced convection; heat source geometry; heat transfer coefficient; local heat flux; point heat source temperature field; pointwise Green´s function; rectangular heat source; rectangular heat sources; substrate plate; surface temperature; thin conducting boards; thin plate finite element discretization; thin plate limit; uniform shear flow; uniform shear flow approximation; Aerospace electronics; Aerospace engineering; Green function; Heat engines; Heat transfer; Mechanical engineering; Printed circuits; Solids; Temperature dependence; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location
Seattle, WA
ISSN
1089-9870
Print_ISBN
0-7803-4475-8
Type
conf
DOI
10.1109/ITHERM.1998.689563
Filename
689563
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