• DocumentCode
    3183524
  • Title

    Forced convection from a rectangular heat source in uniform shear flow: The conjugate Peclet number in the thin plate limit

  • Author

    Li, Yiming ; Ortega, Alfonso

  • Author_Institution
    Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA
  • fYear
    1998
  • fDate
    27-30 May 1998
  • Firstpage
    284
  • Lastpage
    294
  • Abstract
    An analytical Green´s function method is used to formulate the solution to conjugate heat transfer from rectangular heat sources on thin conducting boards in boundary layer flow. The boundary layer flow is modeled by a uniform shear flow approximation. The Green´s functions, which are solutions to the temperature field that arises from a point heat source on the surface, provide a relationship between the local heat flux and surface temperature on the plate, effectively serving the same role as the heat transfer coefficient. The conjugate solution is found by coupling the pointwise Green´s function to a finite element discretization of the thin plate. An extensive parametric study was performed on the effects of Peclet number, board conductivity and thickness, and heat source geometry. A robust correlation for conjugate heat transfer is presented for the limit where the substrate plate can be considered to be thin. The correlation simultaneously accounts for the effects of convective heat transfer and conduction heat transfer into the plate through the use of a conjugate Peclet number defined for the thin plate limit
  • Keywords
    Green´s function methods; boundary layers; cooling; finite element analysis; forced convection; heat conduction; printed circuits; shear flow; temperature distribution; thermal analysis; thermal conductivity; thermal management (packaging); Green´s functions; Peclet number; analytical Green´s function method; board conductivity; board thickness; boundary layer flow; boundary layer flow model; conduction heat transfer; conjugate Peclet number; conjugate heat transfer; conjugate heat transfer correlation; convective heat transfer; forced convection; heat source geometry; heat transfer coefficient; local heat flux; point heat source temperature field; pointwise Green´s function; rectangular heat source; rectangular heat sources; substrate plate; surface temperature; thin conducting boards; thin plate finite element discretization; thin plate limit; uniform shear flow; uniform shear flow approximation; Aerospace electronics; Aerospace engineering; Green function; Heat engines; Heat transfer; Mechanical engineering; Printed circuits; Solids; Temperature dependence; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
  • Conference_Location
    Seattle, WA
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-4475-8
  • Type

    conf

  • DOI
    10.1109/ITHERM.1998.689563
  • Filename
    689563