A Study of Effects of Coolants on Heat Transfer Capability of On-chip Cooling with CNT Micro-fin Architectures by Using CFD Simulation

The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant´s density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.