DocumentCode
3184695
Title
A magnetic fluid seal for rotary blood pumps: Image and computational analyses of behaviors of magnetic fluids
Author
Mitamura, Yoshinori ; Yano, Takao ; Okamoto, Eiji
Author_Institution
Grad. Sch. of Inf. Sci. & Technol., Hokkaido Univ., Sapporo, Japan
fYear
2013
fDate
3-7 July 2013
Firstpage
663
Lastpage
666
Abstract
A magnetic fluid (MF) seal has excellent durability. The performance of an MF seal, however, has been reported to decrease in liquids (several days). We have developed an MF seal that has a shield mechanism. The seal was perfect for 275 days in water. To investigate the effect of a shield, behaviors of MFs in a seal in water were studied both experimentally and computationally. (a) Two kinds of MF seals, one with a shield and one without a shield, were installed in a centrifugal pump. Behaviors of MFs in the seals in water were observed with a video camera and high-speed microscope. In the seal without a shield, the surface of the water in the seal waved and the turbulent flow affected behaviors of the MFs. In contrast, MFs rotated stably in the seal with a shield in water even at high rotational speeds. (b) Computational fluid dynamics analysis revealed that a stationary secondary flow pattern in the seal and small velocity difference between magnetic fluid and water at the interface. These MF behaviors prolonged the life of an MF seal in water.
Keywords
blood; computational fluid dynamics; haemorheology; magnetic fluids; turbulence; video cameras; water; H2O; MF seal performance; centrifugal pump; computational analysis; computational fluid dynamic analysis; durability; high rotational speeds; high-speed microscope; image analysis; magnetic fluid seal; rotary blood pumps; seal wave; stationary secondary flow pattern; turbulent flow affected behaviors; video camera; water surface; Blood; Computational fluid dynamics; Magnetic liquids; Pumps; Seals; Shafts;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6609587
Filename
6609587
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