DocumentCode :
3184825
Title :
Compact low-loss 2.4GHz ISM-band SAW bandpass filter on the LTCC substrate
Author :
Novgorodov, V. ; Freisleben, S. ; Hornsteiner, J. ; Schmachtl, M. ; Vorotnikov, B. ; Heide, P. ; Vossiek, M.
Author_Institution :
SAW Components / PD Modules, EPCOS AG, Munich, Germany
fYear :
2009
fDate :
7-10 Dec. 2009
Firstpage :
2072
Lastpage :
2075
Abstract :
This paper describes a design of a surface acoustic wave (SAW) ladder-type bandpass filter (BPF) for 2.4-2.5 GHz ISM-band, based on the low temperature co-fired ceramic (LTCC) substrate, which can be used in 802.11b/g wireless LAN and Bluetooth applications. It obtains an excellent state-of-the-art performance in the ultra small package. The proposed architecture is based on a combination of SAW and low temperature co-fired ceramic (LTCC) technologies, where the multilayer LTCC substrate is used for integration of matching and passband-driving elements and for obtaining additional transmission zeros. It is comprised of three series and two parallel SAW resonators, realized on the LiTaO3 piezoelectric substrate and connected accordingly to a ladder-type T-topology circuit design, and an additional resonator to obtain an attenuation at 2.57-2.62 GHz IMT-E (TDD) band. Two input/output matching inductors and three additional inductors, permitting to obtain a sufficient suppression level at 2.11-2.17 GHz UMTS (DL) band and harmonics, are completely integrated within ceramic. The described bandpass filter has ultra small dimensions of 1.1 × 1.4 × 0.9 mm, very low insertion losses of -1.5 dB max in the passband. This fully matched SAW bandpass filter has achieved excellent selectivity performance with the up-to-date smallest package size.
Keywords :
3G mobile communication; Bluetooth; UHF filters; band-pass filters; ceramic packaging; inductors; ladder filters; lithium compounds; network topology; surface acoustic wave resonator filters; wireless LAN; 802.11b/g wireless LAN; Bluetooth applications; IMT-E TDD band attenuation; LTCC substrate; LiTaO3; UMTS DL band; compact low-loss ISM-band SAW bandpass filter; frequency 2.11 GHz to 2.17 GHz; frequency 2.4 GHz to 2.5 GHz; frequency 2.57 GHz to 2.62 GHz; harmonics; input-output matching inductors; ladder-type T-topology circuit design; low temperature co-fired ceramic substrate; low temperature co-fired ceramic technology; passband filter; passband-driving elements; piezoelectric substrate; size 0.9 mm; size 1.1 mm; size 1.4 mm; suppression level; surface acoustic wave ladder-type bandpass filter; three series SAW resonators; transmission zeros; two parallel SAW resonators; ultrasmall package; Acoustic waves; Band pass filters; Bluetooth; Ceramics; Inductors; Nonhomogeneous media; Packaging; Surface acoustic waves; Temperature; Wireless LAN; Bandpass filter (BPF); coexistence; ladder-type; low temperature co-fired ceramic (LTCC); surface acoustic wave (SAW); system-in-package (SIP); wireless local area network (WLAN);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2801-4
Electronic_ISBN :
978-1-4244-2802-1
Type :
conf
DOI :
10.1109/APMC.2009.5385302
Filename :
5385302
Link To Document :
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