• DocumentCode
    3186091
  • Title

    Least-material optimization of vertical pin-fin, plate-fin, and triangular-fin heat sinks in natural convective heat transfer

  • Author

    Iyengar, Madhusudan ; Cohen, Avram Bar

  • Author_Institution
    Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
  • fYear
    1998
  • fDate
    27-30 May 1998
  • Firstpage
    295
  • Lastpage
    302
  • Abstract
    A least-material optimization of pin-fin, plate-fin, and triangular-fin array geometries is performed, by extending the use of least-material single fin analysis to multiple fin arrays. The heat dissipation from vertical fin arrays in natural convection is calculated using the Nusselt number correlation by Aihara et al. (Int. J. Heat and Mass Transfer vol. 33, no. 6, pp. 1223-32, 1990) for pin-fins, by Bar-Cohen and Rohsenow (Trans IEEE CHMT vol. 6, pp. 154-8, 1983) for rectangular plate fins, and by Karagiozis et al (Air, vol. 116, pp. 105-11, 1994) for triangular plate fins. Comparisons of the thermal capability of the three different array geometries are carried out on the basis of total heat dissipation and material-specific volumetric heat dissipation. Manufacturability constraints of these heat sinks, and their effects on the final design, are briefly discussed
  • Keywords
    arrays; cooling; design engineering; electronic equipment manufacture; heat sinks; natural convection; optimisation; thermal analysis; thermal management (packaging); Nusselt number correlation; fin array geometry; heat dissipation; heat sinks; least-material optimization; least-material single fin analysis; manufacturability constraints; material-specific volumetric heat dissipation; multiple fin arrays; natural convection; natural convective heat transfer; pin-fin array geometry; pin-fins; plate-fin geometry; plate-fin heat sinks; rectangular plate fins; thermal capability; total heat dissipation; triangular plate fins; triangular-fin array geometry; triangular-fin heat sinks; vertical fin arrays; vertical pin-fin heat sinks; Electronic packaging thermal management; Electronics cooling; Equations; Geometry; Heat engines; Heat sinks; Heat transfer; Isothermal processes; Space heating; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
  • Conference_Location
    Seattle, WA
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-4475-8
  • Type

    conf

  • DOI
    10.1109/ITHERM.1998.689577
  • Filename
    689577