Title :
Simulation and experimental research on thermal protection of the memory embedded missile based on ANSYS
Author :
Feng, Wen ; Xiao-ping, Yang ; Zhao-kui, Diao
Author_Institution :
Nat. Key Lab. of Electron. Meas., Technol. North Univ. of China, Taiyuan, China
Abstract :
The relationship between the object temperature and time during heat transfer was analyzed with the basic principles of heat and mass transfer for the effective thermal protection of the memory. Thermal protection structure was simulated with ANSYS 10.0 and validated by experiment. The result demonstrated that nanometer aerogel which was placed between memory and protective layer, 5mm thick and the thermal conductivity is 0.01 w/ (m.k), makes sure the memory works two hours normally in the environment which the temperature is 125°C. It has some referential value to the protection of the memory and other small equipments embedded missile.
Keywords :
heat transfer; mass transfer; missiles; numerical analysis; thermal barrier coatings; thermal conductivity; thermal insulation; ANSYS 10.0; heat transfer; mass transfer; memory embedded missiles; nanometer aerogel; thermal conductivity; thermal protection structure; Heat transfer; Heating; Materials; Rubber; Temperature distribution; Temperature measurement; ANSYS; Simulation; Thermal conductivity; Thermal protection;
Conference_Titel :
Computer and Information Application (ICCIA), 2010 International Conference on
Conference_Location :
Tianjin
Print_ISBN :
978-1-4244-8597-0
DOI :
10.1109/ICCIA.2010.6141580
