Simulation and experimental research on thermal protection of the memory embedded missile based on ANSYS

The relationship between the object temperature and time during heat transfer was analyzed with the basic principles of heat and mass transfer for the effective thermal protection of the memory. Thermal protection structure was simulated with ANSYS 10.0 and validated by experiment. The result demonstrated that nanometer aerogel which was placed between memory and protective layer, 5mm thick and the thermal conductivity is 0.01 w/ (m.k), makes sure the memory works two hours normally in the environment which the temperature is 125°C. It has some referential value to the protection of the memory and other small equipments embedded missile.