DocumentCode :
3186529
Title :
A comparison of heat sink geometries for laminar forced convection: Numerical simulation of periodically developed flow
Author :
Behnia, Masud ; Copeland, David ; Soodphakdee, Denpong
Author_Institution :
Sch. of Mech. & Manuf. Eng., New South Wales Univ., Sydney, NSW, Australia
fYear :
1998
fDate :
27-30 May 1998
Firstpage :
310
Lastpage :
315
Abstract :
In this study, we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimization of thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1 mm diameter pin fins with a 2 mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out in a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5 m/s. A comparison of heat transfer coefficients and pressure drops is presented
Keywords :
computational fluid dynamics; cooling; forced convection; heat sinks; integrated circuit modelling; integrated circuit packaging; laminar flow; numerical analysis; thermal management (packaging); thermal resistance; 2D computational domain; CFD simulations; air velocity; base area; circular pin fin array; fin area; fin geometry; fin geometry optimization; fin pitch-to-width ratio; flow-parallel symmetry planes; heat sink geometry; heat transfer coefficient; heat transfer performance; laminar air velocity; laminar forced convection; manufacturable geometries; numerical simulation; periodically developed flow; pressure drop; thermal resistance minimization; Electronic packaging thermal management; Electronics cooling; Geometry; Heat sinks; Heat transfer; Numerical simulation; Resistance heating; Surface resistance; Thermal resistance; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
ISSN :
1089-9870
Print_ISBN :
0-7803-4475-8
Type :
conf
DOI :
10.1109/ITHERM.1998.689579
Filename :
689579
Link To Document :
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