A comparison of heat sink geometries for laminar forced convection: Numerical simulation of periodically developed flow

Author

Behnia, Masud ; Copeland, David ; Soodphakdee, Denpong

Author_Institution

Sch. of Mech. & Manuf. Eng., New South Wales Univ., Sydney, NSW, Australia

fYear

1998

fDate

27-30 May 1998

Firstpage

310

Lastpage

315

Abstract

In this study, we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimization of thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1 mm diameter pin fins with a 2 mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out in a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5 m/s. A comparison of heat transfer coefficients and pressure drops is presented

Keywords

computational fluid dynamics; cooling; forced convection; heat sinks; integrated circuit modelling; integrated circuit packaging; laminar flow; numerical analysis; thermal management (packaging); thermal resistance; 2D computational domain; CFD simulations; air velocity; base area; circular pin fin array; fin area; fin geometry; fin geometry optimization; fin pitch-to-width ratio; flow-parallel symmetry planes; heat sink geometry; heat transfer coefficient; heat transfer performance; laminar air velocity; laminar forced convection; manufacturable geometries; numerical simulation; periodically developed flow; pressure drop; thermal resistance minimization; Electronic packaging thermal management; Electronics cooling; Geometry; Heat sinks; Heat transfer; Numerical simulation; Resistance heating; Surface resistance; Thermal resistance; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on

Conference_Location

Seattle, WA

ISSN

1089-9870

Print_ISBN

0-7803-4475-8

Type

conf

DOI

10.1109/ITHERM.1998.689579

Filename

689579