DocumentCode :
3186725
Title :
Integrating mechanical computer-aided engineering tools into the printed wiring board design cycle
Author :
Garfinkel, George A.
Author_Institution :
Danou Technical Center, Visteon Automotive Syst., Allen Park, MI, USA
fYear :
1998
fDate :
27-30 May 1998
Firstpage :
316
Lastpage :
321
Abstract :
Some of the driving factors in the highly competitive electronics industry are the need to reduce cost, shorten design cycle length and increase the quality and reliability of electronic modules and products. To achieve these goals, design engineers are increasingly using mechanical and electrical computer-aided engineering (MCAE and ECAE) tools to help them replace or reduce current build-test-rebuild-retest cycles. These computer simulation tools are expected to be used to screen designs, identify potential areas of concern, provide design guidance and help engineers select the best option from several proposed designs. However, for these tools to be fully effective, they must be tightly and seamlessly integrated with current CAD programs and be an integral part of the product development cycle. They also must be easy to use and able to produce reliable results without violating the demanding time constraints of fast-paced design cycles. While describing a proposed approach to integrate MCAE tools into the PWB design cycle, this paper discusses some of the problems and issues that result from trying to implement such an integration. It is evident that one of the weakest points in this area is software interfacing. This article demonstrates the need for and potential benefits of closer interaction between software suppliers and end users during the development and implementation of software interfaces. Also, it clearly shows the necessity to achieve a successful level of seamless integration in electronic design and analysis tools and the need for developers of those tools to work together towards that goal
Keywords :
circuit CAD; circuit reliability; computer aided engineering; electronic data interchange; printed circuit design; product development; software tools; CAD programs; ECAE tools; MCAE tool integration; MCAE tools; PWB design cycle; build-test-rebuild-retest cycles; computer simulation tools; cost reduction; design cycle time; design cycle time constraints; design guidance; design screening; design selection; electrical computer-aided engineering tools; electronic analysis tools; electronic design tools; electronic modules; electronic products; electronics industry; mechanical computer-aided engineering tool integration; mechanical computer-aided engineering tools; printed wiring board design cycle; product development cycle; quality; reliability; software interface development; software interface implementation; software interfacing; software suppliers; software users; Computer simulation; Costs; Design automation; Design engineering; Electrical engineering computing; Electronics industry; Industrial electronics; Product development; Reliability engineering; Time factors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
ISSN :
1089-9870
Print_ISBN :
0-7803-4475-8
Type :
conf
DOI :
10.1109/ITHERM.1998.689580
Filename :
689580
Link To Document :
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