DocumentCode
3187055
Title
A regularization-free Young´s modulus reconstruction algorithm for ultrasound elasticity imaging
Author
Xiaochang Pan ; Jing Gao ; Jinhua Shao ; Jianwen Luo ; Jing Bai
Author_Institution
Dept. of Biomed. Eng., Tsinghua Univ., Beijing, China
fYear
2013
fDate
3-7 July 2013
Firstpage
1132
Lastpage
1135
Abstract
Ultrasound elasticity imaging aims to reconstruct the distribution of elastic modulus (e.g., Young´s modulus) within biological tissues, since the value of elastic modulus is often related to pathological changes. Currently, most elasticity imaging algorithms face a challenge of choosing the value of the regularization constant. We propose a more applicable algorithm without the need of any regularization. This algorithm is not only simple to use, but has a relatively high accuracy. Our method comprises of a nonrigid registration technique and tissue incompressibility assumption to estimate the two-dimensional (2D) displacement field, and finite element method (FEM) to reconstruct the Young´s modulus distribution. Simulation and phantom experiments are performed to evaluate the algorithm. Simulation and phantom results showed that the proposed algorithm can reconstruct the Young´s modulus with an accuracy of 63~85%.
Keywords
Young´s modulus; biological tissues; biomechanics; biomedical ultrasonics; elasticity; finite element analysis; image reconstruction; medical image processing; phantoms; FEM; Young modulus reconstruction algorithm; biological tissues; elastic modulus; finite element method; nonrigid registration technique; phantom experiments; tissue incompressibility; two-dimensional displacement field; ultrasound elasticity imaging; Elasticity; Finite element analysis; Image reconstruction; Phantoms; Strain; Ultrasonic imaging; Algorithms; Computer Simulation; Elastic Modulus; Elasticity Imaging Techniques; Finite Element Analysis; Imaging, Three-Dimensional; Phantoms, Imaging; Ultrasonics;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6609705
Filename
6609705
Link To Document