Title :
Device and technology challenges for 0.1 μm CMOS
Author_Institution :
Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
Abstract :
Summary form only given. The integrated circuit industry is poised to introduce 0.25 μm products before the end of this year, and is projected to deliver 0.1 μM process in less than 10 years. We will review the challenges ahead and focus on the research opportunities in device and process technology
Keywords :
CMOS integrated circuits; integrated circuit technology; technological forecasting; 0.1 micron; CMOS integrated circuits; device technology; process technology; CMOS process; CMOS technology; Electronics industry; Integrated circuit technology;
Conference_Titel :
Electron Devices Meeting, 1997. Proceedings., 1997 IEEE Hong Kong
Print_ISBN :
0-7803-3802-2
DOI :
10.1109/HKEDM.1997.641997
