Thin-film millimeter-wave subassemblies

Author

Bueb, C. ; Murrow, D.

Author_Institution

Avantek Inc., Folsom, CA, USA

fYear

1988

fDate

25-27 May 1988

Firstpage

547

Abstract

Two thin-film millimeter-wave subassemblies, a 35-GHz low-noise downconverter and an 18- to 40-GHz dual-channel downconverter, are described. The hermetic portion of the 35-GHz downconverter subassembly provides four different circuit functions in a package 1.90-in by 0.75-in by 0.32-in. The dual-channel downconverter subassembly uses three hermetic packages interfaced with small rigid coaxial interconnections. Collectively, these three packages provide five different circuit functions in a total volume of 1.08 cu in. These downconverter subassemblies consist of thin-film circuits which offer reduced system size and low interconnection losses.<>

Keywords

frequency convertors; hybrid integrated circuits; microwave integrated circuits; packaging; thin film circuits; 18 to 40 GHz; EHF; MM-wave type; SHF; dual-channel downconverter; hermetic packages; low-noise downconverter; millimeter-wave subassemblies; rigid coaxial interconnections; thin-film circuits; Circuit noise; Couplers; Integrated circuit interconnections; Millimeter wave circuits; Millimeter wave technology; Noise figure; Noise measurement; Packaging; Thin film circuits; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1988., IEEE MTT-S International

Conference_Location

New York, NY, USA

Type

conf

DOI

10.1109/MWSYM.1988.22094

Filename

22094