Title :
Thermal simulator benchmarking using an SOIC package
Author_Institution :
Motorola Inc., Tempe, AZ, USA
Abstract :
Benchmarking on three thermal simulators representing the finite element and boundary element methods is conducted to assess their performance for solution of the equilibrium die temperature of a SOIC (small outline integrated circuit). Accuracy and efficiency (speed, meshing, and cost) are compared for the simulators. Compatibility with other CAD (computer aided design) tools such as solid modeler and CFD (computational fluid dynamics) is also investigated
Keywords :
boundary-elements methods; circuit CAD; circuit simulation; computational fluid dynamics; finite element analysis; integrated circuit modelling; integrated circuit packaging; mesh generation; thermal analysis; thermal management (packaging); CAD tools; CFD; SOIC; SOIC package; boundary element method; computational fluid dynamics; computer aided design; equilibrium die temperature; finite element method; small outline integrated circuit; solid modeler CAD tool; thermal simulator accuracy; thermal simulator benchmarking; thermal simulator cost; thermal simulator efficiency; thermal simulator meshing; thermal simulator speed; thermal simulators; Boundary element methods; Circuit simulation; Computational fluid dynamics; Computational modeling; Costs; Design automation; Finite element methods; Integrated circuit packaging; Temperature; Thermal conductivity;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689587
