Title :
Thermal analysis design tool for parallel plate heatsinks
Author :
Chen, C.L. ; Peppi, Kim ; Day, Scott ; Liao, C.
Author_Institution :
Rockwell Inst. Sci. Center, Thousand Oaks, CA, USA
Abstract :
A thermal analysis tool developed for laminar, narrow gap parallel plate heatsinks with various topologies such as side inlet and side outlet (SISO), top inlet and side outlet (TISO) or arbitrary location of inlet and side outlet is presented and examined. For simple topologies, the software has been validated with known exact solutions and CFD results. The fan curves and prescribed heat flux at base plate are incorporated into the software. Current analysis software combined with graphic user interface visualization tools have been demonstrated to be a useful, fast, and friendly tool for parametric design studies
Keywords :
CAD; computational fluid dynamics; design engineering; electronic engineering computing; graphical user interfaces; heat sinks; laminar flow; software tools; thermal analysis; CFD; SISO heatsinks; TISO heatsinks; arbitrary inlet location; base plate heat flux; current analysis software; fan curves; graphic user interface visualization tools; heat flux; heatsink topology; laminar narrow gap parallel plate heatsinks; parallel plate heatsinks; parametric design; side inlet-side outlet heatsinks; thermal analysis design tool; thermal analysis tool; top inlet-side outlet heatsinks; Circuit topology; Computational fluid dynamics; Electronic packaging thermal management; Graphics; Heat sinks; Heat transfer; Reduced instruction set computing; Software design; User interfaces; Visualization;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689589
