DocumentCode
318850
Title
Analysis of the feasibility of dynamic thermal testing in digital circuits
Author
Altet, Josep ; Rubio, Antonio ; Tamamoto, Hideo
Author_Institution
Dept. of Electr. Eng., Univ. Politech. de Catalunya, Barcelona, Spain
fYear
1997
fDate
17-19 Nov 1997
Firstpage
149
Lastpage
154
Abstract
Temperature can be used as a test observable: some failures when activated produce an increase in local power dissipation, changing the surface thermal map of the IC, being detectable with built-in thermal sensors. In this work, both the feasibility of this testing technique and the generation of the specific test pattern are discussed
Keywords
digital integrated circuits; dynamic testing; electric sensing devices; fault location; integrated circuit testing; temperature measurement; IC; bridging failure; built-in thermal sensors; controllability; digital circuits; dynamic thermal testing; feasibility; local power dissipation; surface thermal map; test pattern; CMOS digital integrated circuits; Circuit testing; Digital circuits; Heat sinks; Power dissipation; Temperature sensors; Thermal conductivity; Thermal engineering; Thermal sensors; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 1997. (ATS '97) Proceedings., Sixth Asian
Conference_Location
Akita
ISSN
1081-7735
Print_ISBN
0-8186-8209-4
Type
conf
DOI
10.1109/ATS.1997.643951
Filename
643951
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