Title :
Modeling of arbitrary power-ground planes with slot by using integral equation and transmission line method
Author :
Zou, Guo-Ping ; Li, Er-Ping ; Wei, Xing-Chang ; Cui, Xiang ; Luo, Guang-Xiao
Author_Institution :
Sch. of Electr. & Electron. Eng., North China Electr. Power Univ., Beijing, China
Abstract :
A coupled integral equation equivalent circuit (IEEC) and transmission line (TML) method is used to model the gapped power-ground planes. The integral equation equivalent circuit method can model an arbitrary shaped power-ground pair with much less time than usual commercial software. However, in gaped planes, there is strong coupling between the two sides of narrow slot, so the coupling effects should be taken into account in the modeling. In this model, the segmental lumped circuits of coupled microstrip lines are integrated to the equivalent circuit, which is deprived by the integral equation equivalent circuit method for arbitrary shaped power-ground (PG) planes. The proposed method has been examined by using he commercial simulator HFSS through several examples.
Keywords :
electromagnetic interference; integral equations; microstrip lines; semiconductor device packaging; transmission lines; HFSS simulator; IEEC; TML method; arbitrary power-ground planes modeling; coupled microstrip lines; coupling effects; electromagnetic interference; electronic packaging; integral equation; integral equation equivalent circuit; segmental lumped circuits; transmission line method; Circuit noise; Coupling circuits; Electromagnetic modeling; Electronics packaging; Equivalent circuits; Integral equations; Microstrip; Power engineering and energy; Power transmission lines; Shape; Electronic packaging; equivalent circuit; integral equation; power/signal integrity;
Conference_Titel :
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2801-4
Electronic_ISBN :
978-1-4244-2802-1
DOI :
10.1109/APMC.2009.5385477