DocumentCode :
3188662
Title :
Software tools for concurrent design of electronic systems-benchmarking of various finite elements and volume analysis packages
Author :
Ghosh, Prosenjit
Author_Institution :
Intel Corp., Hillsboro, OR, USA
fYear :
1998
fDate :
27-30 May 1998
Firstpage :
378
Lastpage :
385
Abstract :
Selecting analysis software can be a daunting task. Over the years, analysis tools have evolved from being off-line evaluation and study tools to a mainstream design and development necessity for concurrent design. These software tools are now a compelling requirement for a fiercely competitive environment with a reduced product development cycle time. Current solvers are complex algorithms that often require extensive research time to comprehend and consume precious time to understand. In this complex environment, the educated customer is clearly in the best position to take the challenge. This paper outlines industry tested proven techniques and processes to guide the reader through the difficult selection process to ensure optimum selection. A step-by-step approach is shown to identify and document specific user needs and establish a foundation for the selection and decision process. A simplified approach to understanding solver routines is also discussed. Details include a fundamentals review, without dissertation, of the various solver techniques from finite element to finite volume, and their respective merits. This paper is geared to assist users in selection of the best analysis tool for their needs. Correct benchmarking techniques are the kernel of this process and they are discussed carefully to assist and ensure correct software selection for the needs at hand
Keywords :
CAD; concurrent engineering; electronic engineering computing; finite element analysis; finite volume methods; product development; software selection; software tools; analysis package benchmarking; analysis software selection; analysis tools; benchmarking techniques; concurrent design; concurrent electronic systems design; electronic systems; finite element analysis packages; finite volume analysis packages; industry tested techniques; optimum software selection; product development cycle time; research time; software selection; software tools; solver algorithms; solver routines; solver techniques; user needs identification; Algorithm design and analysis; Application software; Electronics packaging; Finite element methods; Kernel; Marketing and sales; Product development; Software packages; Software tools; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
ISSN :
1089-9870
Print_ISBN :
0-7803-4475-8
Type :
conf
DOI :
10.1109/ITHERM.1998.689590
Filename :
689590
Link To Document :
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