DocumentCode
3189200
Title
Improved chronic neural stimulation using high surface area platinum electrodes
Author
Shah, Kedar G. ; Tolosa, Vanessa M. ; Tooker, Angela C. ; Felix, Sarah H. ; Pannu, Satinderpall S.
Author_Institution
Lawrence Livermore Nat. Lab., Lawrence, CA, USA
fYear
2013
fDate
3-7 July 2013
Firstpage
1546
Lastpage
1549
Abstract
We report a novel nano-cluster platinum (NCPt) film that exhibits enhanced performance as an electrode material for neural stimulation applications. Nano-cluster films were deposited using a custom physical vapor deposition process and patterned on a flexible polyimide microelectrode array using semiconductor processing technology. Electrode performance was characterized in vitro using electrochemical impedance spectroscopy and compared with sputtered thinfilm platinum (TFPt) electrodes. We characterized electrode impedance, charge storage capacity, voltage transient properties, and relative surface area enhancement in vitro. Preliminary lifetime testing of the electrode reveals that the NCPt electrodes degrade more slowly than TFPt electrodes. The combination of material biocompatibility, electrochemical performance, and preliminary lifetime results point to a promising new electrode material for neural interface devices.
Keywords
biomedical electrodes; electrochemical impedance spectroscopy; metallic thin films; nanobiotechnology; nanofabrication; neurophysiology; platinum; sputter deposition; Pt; charge storage capacity; chronic neural stimulation; electrochemical impedance spectroscopy; flexible polyimide microelectrode array; high surface area platinum electrodes; nanocluster platinum film; neural interface devices; physical vapor deposition; relative surface area enhancement; semiconductor processing technology; sputtered thin film; voltage transient properties; Arrays; Electrodes; Films; Impedance; Surface impedance; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6609808
Filename
6609808
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