DocumentCode :
3189362
Title :
NeuroRex: A clinical neural interface roadmap for EEG-based brain machine interfaces to a lower body robotic exoskeleton
Author :
Contreras-Vidal, Jose L. ; Grossman, Robert G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Houston, Houston, TX, USA
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
1579
Lastpage :
1582
Abstract :
In this communication, a translational clinical brain-machine interface (BMI) roadmap for an EEG-based BMI to a robotic exoskeleton (NeuroRex) is presented. This multi-faceted project addresses important engineering and clinical challenges: It addresses the validation of an intelligent, self-balancing, robotic lower-body and trunk exoskeleton (Rex) augmented with EEG-based BMI capabilities to interpret user intent to assist a mobility-impaired person to walk independently. The goal is to improve the quality of life and health status of wheelchair-bounded persons by enabling standing and sitting, walking and backing, turning, ascending and descending stairs/curbs, and navigating sloping surfaces in a variety of conditions without the need for additional support or crutches.
Keywords :
biomechanics; brain-computer interfaces; electroencephalography; handicapped aids; medical robotics; orthotics; BMI roadmap; EEG-based BMI capability; EEG-based brain machine interface; NeuroRex; backing motion; clinical neural interface roadmap; curb ascent; curb descent; intelligent self-balancing robotic lower-body exoskeleton; lower body robotic exoskeleton; mobility-impaired person assistance; sitting motion; sloping surface navigation; stair ascent; stair descent; standing motion; translational clinical brain-machine interface roadmap; trunk exoskeleton; turning motion; walking motion; wheelchair-bounded person health status; wheelchair-bounded person quality of life; Exoskeletons; Legged locomotion; Muscles; Reliability; Robot sensing systems; Spinal cord injury;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6609816
Filename :
6609816
Link To Document :
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