DocumentCode
3189545
Title
Comparison of heat transfer correlations for single- and two-phase microchannel flows for microelectronics cooling
Author
Riehl, R.R. ; Seleghim, P., Jr. ; Ochterbeck, J.M.
Author_Institution
Sao Paulo Univ., Brazil
fYear
1998
fDate
27-30 May 1998
Firstpage
409
Lastpage
416
Abstract
A comparison of four heat transfer correlations for single-phase and six for two-phase microchannel flows has been conducted, for a Reynolds number range between 300 and 80,000. For this range, the results for single-phase correlations are very close to those for two-phase flow for low mixture quality, although for higher mixture qualities, the two-phase correlations had higher values for the Nusselt number. This means that correlations from several investigations were compared with three different working fluids and equivalent flow conditions. Correlations employing the boiling and/or convective number, along with the Martinelli parameter, were found to be more consistent, while several correlations developed for liquid flows appear to require further study, and potentially modification, prior to use in microchannel flow applications. Although much information has been gained recently, further investigation is required to improve the understanding of heat transfer in single-phase and two-phase microchannel flows
Keywords
boiling; convection; cooling; correlation methods; flow simulation; integrated circuit packaging; thermal analysis; thermal management (packaging); two-phase flow; Martinelli parameter; Nusselt number; Reynolds number; boiling number; convective number; flow conditions; heat transfer; heat transfer correlations; liquid flows; microchannel flow; microchannel flow applications; microelectronics cooling; mixture quality; single-phase microchannel flows; two-phase flow; two-phase microchannel flows; working fluids; Electronic components; Electronics cooling; Fluid flow; Heat engines; Heat transfer; Immersion cooling; Mechanical engineering; Microchannel; Microelectronics; Space heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location
Seattle, WA
ISSN
1089-9870
Print_ISBN
0-7803-4475-8
Type
conf
DOI
10.1109/ITHERM.1998.689594
Filename
689594
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