• DocumentCode
    318974
  • Title

    Optimization Of A Copper Pattern Plating Process With Planned Experimentation

  • Author

    Poon, Gary K K ; Law, H.W.

  • Author_Institution
    City Polytechnic Of Hong Kong, Hong Kong
  • fYear
    1994
  • fDate
    3-5 Oct 1994
  • Firstpage
    529
  • Lastpage
    535
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Factory 2000 - Advanced Factory Automation, Fourth International Conference on (Conf. Publ. No. 398)
  • Conference_Location
    IET
  • Print_ISBN
    0-85296-626-1
  • Type

    conf

  • Filename
    644272