DocumentCode
318974
Title
Optimization Of A Copper Pattern Plating Process With Planned Experimentation
Author
Poon, Gary K K ; Law, H.W.
Author_Institution
City Polytechnic Of Hong Kong, Hong Kong
fYear
1994
fDate
3-5 Oct 1994
Firstpage
529
Lastpage
535
fLanguage
English
Publisher
iet
Conference_Titel
Factory 2000 - Advanced Factory Automation, Fourth International Conference on (Conf. Publ. No. 398)
Conference_Location
IET
Print_ISBN
0-85296-626-1
Type
conf
Filename
644272
Link To Document