DocumentCode :
3190025
Title :
Shared fuse macro for multiple embedded memory devices with redundancy
Author :
Ouellette, Michael R. ; Anand, Darren L. ; Jakobsen, Peter
Author_Institution :
Microelectron. Div., IBM Corp., Essex Junction, VT, USA
fYear :
2001
fDate :
2001
Firstpage :
191
Lastpage :
194
Abstract :
Customers designing increasingly complex integrated circuits are turning to ASIC vendors to help bring their products to market faster than their competitors. ASIC designs with large amounts of embedded memory must use fuse-enabled redundancy techniques to maintain price competitive yield. IBM has developed a data compression and shared fuse technique to accommodate large numbers of redundant elements in an ASIC. This technique minimizes or eliminates problems associated with a large number of fuses distributed within many embedded memories on an ASIC
Keywords :
DRAM chips; SRAM chips; application specific integrated circuits; data compression; electric fuses; integrated circuit yield; redundancy; ASIC; data compression; fuse-enabled redundancy techniques; multiple embedded memory devices; price competitive yield; redundant elements; shared fuse macro; Application specific integrated circuits; Fuses; Integrated circuit yield; Logic; Manufacturing; Microelectronics; PROM; Random access memory; Strontium; Turning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits, 2001, IEEE Conference on.
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-6591-7
Type :
conf
DOI :
10.1109/CICC.2001.929753
Filename :
929753
Link To Document :
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