Effects of non-uniform substrate temperature on the clock signal integrity in high performance designs

Author

Ajami, Amir H. ; Pedram, Massoud ; Banerjee, Kaustav

Author_Institution

Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA

fYear

2001

fDate

2001

Firstpage

233

Lastpage

236

Abstract

This paper presents the analysis and modeling of the nonuniform substrate temperature in high performance ICs and its effect on the integrity of the clock signal. Using a novel non-uniform temperature-dependent distributed RC interconnect delay model, the behavior of clock skew in the presence of the substrate thermal gradients is analyzed and some design guidelines are provided to ensure the integrity of the clock signal

Keywords

delay estimation; digital integrated circuits; integrated circuit interconnections; integrated circuit modelling; substrates; temperature distribution; timing; IC modeling; clock signal integrity; clock skew; design guidelines; distributed RC interconnect delay model; high performance ICs; high performance digital designs; interconnect temperature profile; nonuniform substrate temperature modelling; nonuniform temperature-dependent delay model; substrate thermal gradients; Clocks; Equations; Heat transfer; Integrated circuit interconnections; Signal analysis; Signal design; Space heating; Temperature; Thermal conductivity; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits, 2001, IEEE Conference on.

Conference_Location

San Diego, CA

Print_ISBN

0-7803-6591-7

Type

conf

DOI

10.1109/CICC.2001.929762

Filename

929762