DocumentCode :
3190527
Title :
Evaluation of substrate noise coupling in RFICs (invited)
Author :
Nagata, Makoto ; Lin, Xihua ; Azuma, Naoya ; Yamaguchi, Masahiro
Author_Institution :
Dept. of Inf. Sci., Kobe Univ., Japan
fYear :
2011
fDate :
Nov. 30 2011-Dec. 2 2011
Firstpage :
141
Lastpage :
144
Abstract :
Substrate noise coupling and impacts on RF integrated circuits (RFICs) have been intensively studied for intending a single chip solution of wireless communication systems. On-chip measurements characterize noises from digital parts of mixed-signal ICs in terms of noise generation as well as noise propagation through a silicon substrate, demonstrated by silicon results with sub-100 nm CMOS test vehicles. Simulation and emulation help further understanding of the interference of such noises with RFIC operation as well as their impacts on RF communication.
Keywords :
CMOS integrated circuits; integrated circuit noise; integrated circuit testing; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; silicon; CMOS test vehicles; RF communication; mixed-signal integrated circuits; noise propagation; on-chip measurements; radiofrequency; substrate noise coupling; wireless communication systems; CMOS RF Circuits; Signal Integrity; Substrate Noise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio-Frequency Integration Technology (RFIT), 2011 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0517-5
Type :
conf
DOI :
10.1109/RFIT.2011.6141785
Filename :
6141785
Link To Document :
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