Title :
CMOS broadband amplifiers for optical communications and optical interconnects
Author :
Hsu, Shawn S H ; Cho, Wei-Han ; Chen, Sheng-Wen ; Jin, Jun-De
Author_Institution :
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fDate :
Nov. 30 2011-Dec. 2 2011
Abstract :
This paper presents different design concepts and approaches of CMOS broadband amplifiers for optical communications and optical interconnects. The design techniques of distributed amplifier (DA), capacitive peaking, and inductor/transformer peaking are reviewed. Using the proposed inductive peaking techniques, we have demonstrated previously a 40-Gb/s transimpedance amplifier (TIA) in 0.18 μm CMOS and a broadband amplifier with a 70-GHz bandwidth in 0.13 μm CMOS. With an emphasis on low power and miniature characteristics, different TIA topologies are discussed for the emerging applications of optical interconnects. Our recent study demonstrates a TIA achieving a transimpedance gain of 54.5 dBΩ and a bandwidth of 4.3 GHz under power consumption of 11.5 mW with a chip area of only 0.0077 mm2 in 0.18 μm CMOS, which permits a data transmission rate up to 7 Gb/s for optical interconnect applications.
Keywords :
CMOS analogue integrated circuits; integrated optoelectronics; microwave amplifiers; optical communication; optical interconnections; wideband amplifiers; CMOS broadband amplifiers; DA; TIA; bandwidth 4.3 GHz; capacitive peaking; distributed amplifier; frequency 70 GHz; inductor-transformer peaking; optical communications; optical interconnection; power 11.5 mW; size 0.13 mum; size 0.18 mum; transimpedance amplifier; Bandwidth; Broadband amplifiers; CMOS integrated circuits; CMOS technology; Gain; Inductors; Optical interconnections; CMOS; broadband amplifier; low power; optical interconnects; transimpedance amplifier (TIA);
Conference_Titel :
Radio-Frequency Integration Technology (RFIT), 2011 IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4577-0517-5
DOI :
10.1109/RFIT.2011.6141788