Title :
Table of contents
Abstract :
The following topics are dealt with: electronic packaging and systems; low power link design; signal integrity; through silicon via (TSV) modeling; power integrity; advanced interconnect modeling; RF packaging; scattering parameter tabular data model; statistical link performance; EM modeling; and design and analysis of high speed links.
Keywords :
electromagnetic compatibility; electronics packaging; low-power electronics; statistical analysis; three-dimensional integrated circuits; EM modeling; RF packaging; TSV modeling; advanced interconnect modeling; electronic packaging; high speed link; low power link design; power integrity; scattering parameter tabular data model; signal integrity; statistical link performance; through-silicon-via technology;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642528
