Title :
Heat-pipes for electronic devices cooling and evaluation of their thermal performance
Author :
Namba, Kenichi ; Kimura, Naoki ; Niekawa, Y. ; Kimura, Yuichi ; Hashimoto, Nobuyki
Author_Institution :
Furukawa Electr. Co. Ltd., Japan
Abstract :
This paper reports on the performance of miniature heat-pipes developed for the cooling of electronic equipment and on evaluation of the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipes were conducted on their thermal properties and reliability. The results indicate that the miniature heat-pipe can be applied to electronic equipment cooling, and evaluation tests of the cooling system using this miniature heat-pipe have clarified the effectiveness of the miniature heat-pipe
Keywords :
cooling; electronic equipment testing; heat pipes; notebook computers; packaging; reliability; thermal analysis; cooling; cooling system evaluation tests; electronic device cooling; electronic equipment; electronic equipment cooling; heat-pipes; miniature heat-pipes; notebook computer cooling systems; reliability; thermal performance; thermal properties; Artificial intelligence; Cellular neural networks; Electronics cooling; Heat sinks; Large Hadron Collider; Space cooling; Space heating; Surface contamination; Testing;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689602
