Title :
Multi-physics modeling of through-silicon vias with equivalent-circuit approach
Author :
Liu, En-Xiao ; Li, Er-Ping ; EWE, Wei-Bin ; Lee, Hui Min
Author_Institution :
Adv. Electron. & Electromagn. (AEE) Dept., Inst. of High Performance Comput. (A*STAR IHPC), Singapore, Singapore
Abstract :
Multi-physics modeling offers rich opportunities for studying the properties of through-silicon vias (TSV). Results of a TSV study with the theories of electromagnetics, semiconductor physics, and thermal physics are presented. Equivalent circuit models are used to draw together the three different theories to perform the TSV modeling. Moreover, a single TSV is examined for high-speed signal transmission with surface waves. Some pertinent questions are posed regarding multi-physics modeling of TSVs.
Keywords :
equivalent circuits; integrated circuit modelling; three-dimensional integrated circuits; TSV modeling; electromagnetics; equivalent-circuit; high-speed signal transmission; multiphysics modeling; semiconductor physics; surface wave; thermal physics; through-silicon via; Capacitance; Equivalent circuits; Integrated circuit modeling; Mathematical model; Physics; Silicon; Through-silicon vias; compact equivalent circuit; electromagnetic modeling; multiphysics modeling; semiconductor physics; surface wave transmission line; thermal modeling; through-silicon via;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642537
