DocumentCode
3191036
Title
Jitter in deep sub-micron interconnect
Author
Jang, Jinwook ; Xu, Sheng ; Burleson, Wayne
Author_Institution
Dept. of Electr. & Comput. Eng., Massachusetts Univ., USA
fYear
2005
fDate
11-12 May 2005
Firstpage
84
Lastpage
89
Abstract
Timing jitter in long on-chip interconnects has become an increasingly important issue in signal integrity and timing violations. In this paper, we focus on cycle-to-cycle jitter induced by repeater power supply noise in both point-to-point and branched RC and RLC interconnects in 70nm CMOS. We develop an analytical expression for jitter based on propagation delay variation that accurately predicts HSPICE simulation results. We show the difference in impact between RC and RLC wire models on jitter (up to 64%). We also show a method for jitter-optimal repeater insertion which differs from conventional delay optimal insertion methods, resulting in larger repeaters. Finally, we introduce methods which can decrease timing violations in branched global interconnects by adjusting repeater size and tuning the phase of the power supply noise.
Keywords
CMOS integrated circuits; RC circuits; RLC circuits; SPICE; circuit optimisation; circuit simulation; clocks; integrated circuit interconnections; integrated circuit noise; microprocessor chips; timing circuits; timing jitter; 70 nm; HSPICE simulation; RC interconnects; RC wire model; RLC interconnects; RLC wire model; cycle-to-cycle jitter; delay optimal insertion methods; jitter-optimal repeater insertion; on-chip interconnects; power supply noise; propagation delay variation; signal integrity; submicron interconnect; timing jitter; Analytical models; Integrated circuit interconnections; Phase noise; Power supplies; Predictive models; RLC circuits; Repeaters; Resonance; Timing jitter; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI, 2005. Proceedings. IEEE Computer Society Annual Symposium on
Print_ISBN
0-7695-2365-X
Type
conf
DOI
10.1109/ISVLSI.2005.45
Filename
1430115
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