• DocumentCode
    3191036
  • Title

    Jitter in deep sub-micron interconnect

  • Author

    Jang, Jinwook ; Xu, Sheng ; Burleson, Wayne

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Massachusetts Univ., USA
  • fYear
    2005
  • fDate
    11-12 May 2005
  • Firstpage
    84
  • Lastpage
    89
  • Abstract
    Timing jitter in long on-chip interconnects has become an increasingly important issue in signal integrity and timing violations. In this paper, we focus on cycle-to-cycle jitter induced by repeater power supply noise in both point-to-point and branched RC and RLC interconnects in 70nm CMOS. We develop an analytical expression for jitter based on propagation delay variation that accurately predicts HSPICE simulation results. We show the difference in impact between RC and RLC wire models on jitter (up to 64%). We also show a method for jitter-optimal repeater insertion which differs from conventional delay optimal insertion methods, resulting in larger repeaters. Finally, we introduce methods which can decrease timing violations in branched global interconnects by adjusting repeater size and tuning the phase of the power supply noise.
  • Keywords
    CMOS integrated circuits; RC circuits; RLC circuits; SPICE; circuit optimisation; circuit simulation; clocks; integrated circuit interconnections; integrated circuit noise; microprocessor chips; timing circuits; timing jitter; 70 nm; HSPICE simulation; RC interconnects; RC wire model; RLC interconnects; RLC wire model; cycle-to-cycle jitter; delay optimal insertion methods; jitter-optimal repeater insertion; on-chip interconnects; power supply noise; propagation delay variation; signal integrity; submicron interconnect; timing jitter; Analytical models; Integrated circuit interconnections; Phase noise; Power supplies; Predictive models; RLC circuits; Repeaters; Resonance; Timing jitter; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI, 2005. Proceedings. IEEE Computer Society Annual Symposium on
  • Print_ISBN
    0-7695-2365-X
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2005.45
  • Filename
    1430115