Title :
Exploring the rogue wave phenomenon in 3D power distribution networks
Author :
Hu, Xiang ; Peng Du ; Cheng, Chung-Kuan
Author_Institution :
ECE Dept., Univ. of California, San Diego, CA, USA
Abstract :
This paper discusses the electrical characteristics of power distribution networks (PDNs) in 3DICs on both system and chip level. In the system-level analysis the global resonance effects in 3D PDNs are highlighted. For chip-level analysis, detailed metal-layer-based power grid model is proposed for the first time for 3D PDNs. With the detailed power grid model, local resonance effects that are unique to 3D PDNs are revealed. The spatial and temporal impacts of distributed current sources on the time-domain noise of 3D PDNs are also explored based on the multi-source worst-case noise calculation algorithm. Simulation results demonstrate the “Rogue Wave” phenomenon in 3D PDNs.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit noise; network analysis; three-dimensional integrated circuits; 3D IC; 3D power distribution networks; chip level; distributed current source; electrical characteristics; global resonance effects; multisource worst case noise calculation; power grid model; rogue wave phenomena; spatial impact; system level analysis; temporal impact; Analytical models; Impedance; Metals; Noise; Power grids; Solid modeling; Three dimensional displays;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642543
