Tutorial 3: Process Technology Development and New Design Opportunities in 3D Integration Technology

3D integration offers inter-strata interconnect with high connectivity density, low parasitics, and shorter lengths. This bring advantages in increased interconnect bandwidth, reduced interconnect latency and reduced power consumption in comparison with individual packaged chips on a board or packages with wire bonded stacked die. 3D integration can compete with, or even surpass, SoC (system on a chip) integration in terms of interconnect performance while allowing for differentiated process technologies for the various strata.