DocumentCode :
3191236
Title :
Size and temperature effects on the resistance of copper and carbon nanotubes nano-interconnects
Author :
Chiariello, Andrea G. ; Miano, Giovanni ; Maffucci, Antonio
Author_Institution :
Dept. of Electr. Eng., Univ. of Naples Federico II, Naples, Italy
fYear :
2010
fDate :
25-27 Oct. 2010
Firstpage :
97
Lastpage :
100
Abstract :
The electrical performances of nano-interconnects are affected by temperature and size, which may seriously limit the current density and the reliability. This paper introduces such effects in the modelling of the electrical resistance of nano-interconnects, either made by copper and carbon-nanotubes. A simple and accurate semi-analytical model is proposed to describe the impact of size and temperature changes on the resistance of carbon nanotube interconnects. Case-studies are carried out with reference to 22nm technology node applications.
Keywords :
carbon nanotubes; semiconductor device reliability; carbon nanotubes nano-interconnects; current density; electrical resistance; reliability; Carbon nanotubes; Conductivity; Copper; Integrated circuit interconnections; Resistance; Wires; carbon nanotubes; interconnects; nanoelectronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
Type :
conf
DOI :
10.1109/EPEPS.2010.5642555
Filename :
5642555
Link To Document :
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