• DocumentCode
    3191241
  • Title

    Tutorial 6: Enhancing Yield through Design for Manufacturability (DFM)

  • Author

    Elakkumanan, P.

  • fYear
    2008
  • fDate
    17-19 March 2008
  • Firstpage
    8
  • Lastpage
    9
  • Abstract
    Summary form only given. This part of the tutorial will discuss in detail the manufacturing challenges in nanoscale VLSI and consequent design for manufacturability (DFM) approaches by taking a holistic approach in analyzing and addressing different process variability effects. We review the dominant process variations in semiconductor manufacturing process that affect the design yield, show their impact on layout quality, and present currently practiced DFM techniques to mitigate the effect of these variations. We also discuss various manufacturing-aware physical and circuit design methodologies and techniques for parametric yield improvement. This includes correct-by-construction methodologies such as Restricted Design Rules (RDRs) as well as manufacturing aware design approaches. In addition, we will briefly mention some of the many accepted and possible mitigation techniques in design post processing (after tape-out) and will introduce the concept of manufacturing for design (MFD) through design-intent processing.
  • Keywords
    VLSI; design for manufacture; integrated circuit design; integrated circuit yield; nanoelectronics; circuit design methodologies; circuit layout quality; correct-by-construction methodologies; design for manufacturability approach; design yield enhancement; nanoscale VLSI; parametric yield improvement; semiconductor manufacturing process;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-0-7695-3117-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2008.4479689
  • Filename
    4479689