DocumentCode
3191241
Title
Tutorial 6: Enhancing Yield through Design for Manufacturability (DFM)
Author
Elakkumanan, P.
fYear
2008
fDate
17-19 March 2008
Firstpage
8
Lastpage
9
Abstract
Summary form only given. This part of the tutorial will discuss in detail the manufacturing challenges in nanoscale VLSI and consequent design for manufacturability (DFM) approaches by taking a holistic approach in analyzing and addressing different process variability effects. We review the dominant process variations in semiconductor manufacturing process that affect the design yield, show their impact on layout quality, and present currently practiced DFM techniques to mitigate the effect of these variations. We also discuss various manufacturing-aware physical and circuit design methodologies and techniques for parametric yield improvement. This includes correct-by-construction methodologies such as Restricted Design Rules (RDRs) as well as manufacturing aware design approaches. In addition, we will briefly mention some of the many accepted and possible mitigation techniques in design post processing (after tape-out) and will introduce the concept of manufacturing for design (MFD) through design-intent processing.
Keywords
VLSI; design for manufacture; integrated circuit design; integrated circuit yield; nanoelectronics; circuit design methodologies; circuit layout quality; correct-by-construction methodologies; design for manufacturability approach; design yield enhancement; nanoscale VLSI; parametric yield improvement; semiconductor manufacturing process;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
978-0-7695-3117-5
Type
conf
DOI
10.1109/ISQED.2008.4479689
Filename
4479689
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