Abstract :
Summary form only given. The product development challenges for high-tech companies are even greater than most industries, thanks in large part to their dependence on an increasingly distributed and complex global value chain and extreme pressure to deliver innovation to market quicker than their fierce competition.That chain of frequently independent companies collaborating on these shrinking project timeline stretches from product conception to chip design, product development, production/assembly, testing, packaging, and delivery. Central to addressing these challenges are solutions and interoperable IT enterprise architectures that can streamline this innovation pipeline. In this presentation the author discusses the opportunities to shrink product time-to-market by more quickly, efficiently, and securely collaborating and integrating with product development value chain partners.
Keywords :
assembling; integrated circuit design; integrated circuit packaging; integrated circuit testing; time to market; chip assembly; chip design; chip packaging; chip testing; global value chain integration; interoperable IT enterprise architectures; product development; time-to-market; Assembly; Chip scale packaging; Companies; International collaboration; Product development; Production; Speech; Technological innovation; Testing; Time to market;
