• DocumentCode
    3191257
  • Title

    Plenary Speech 1P1: Shrinking time-to-market through global value chain integration

  • Author

    Gude, Drew

  • Author_Institution
    Microsoft Corp., Redmond
  • fYear
    2008
  • fDate
    17-19 March 2008
  • Firstpage
    15
  • Lastpage
    15
  • Abstract
    Summary form only given. The product development challenges for high-tech companies are even greater than most industries, thanks in large part to their dependence on an increasingly distributed and complex global value chain and extreme pressure to deliver innovation to market quicker than their fierce competition.That chain of frequently independent companies collaborating on these shrinking project timeline stretches from product conception to chip design, product development, production/assembly, testing, packaging, and delivery. Central to addressing these challenges are solutions and interoperable IT enterprise architectures that can streamline this innovation pipeline. In this presentation the author discusses the opportunities to shrink product time-to-market by more quickly, efficiently, and securely collaborating and integrating with product development value chain partners.
  • Keywords
    assembling; integrated circuit design; integrated circuit packaging; integrated circuit testing; time to market; chip assembly; chip design; chip packaging; chip testing; global value chain integration; interoperable IT enterprise architectures; product development; time-to-market; Assembly; Chip scale packaging; Companies; International collaboration; Product development; Production; Speech; Technological innovation; Testing; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-0-7695-3117-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2008.4479690
  • Filename
    4479690