DocumentCode
3191257
Title
Plenary Speech 1P1: Shrinking time-to-market through global value chain integration
Author
Gude, Drew
Author_Institution
Microsoft Corp., Redmond
fYear
2008
fDate
17-19 March 2008
Firstpage
15
Lastpage
15
Abstract
Summary form only given. The product development challenges for high-tech companies are even greater than most industries, thanks in large part to their dependence on an increasingly distributed and complex global value chain and extreme pressure to deliver innovation to market quicker than their fierce competition.That chain of frequently independent companies collaborating on these shrinking project timeline stretches from product conception to chip design, product development, production/assembly, testing, packaging, and delivery. Central to addressing these challenges are solutions and interoperable IT enterprise architectures that can streamline this innovation pipeline. In this presentation the author discusses the opportunities to shrink product time-to-market by more quickly, efficiently, and securely collaborating and integrating with product development value chain partners.
Keywords
assembling; integrated circuit design; integrated circuit packaging; integrated circuit testing; time to market; chip assembly; chip design; chip packaging; chip testing; global value chain integration; interoperable IT enterprise architectures; product development; time-to-market; Assembly; Chip scale packaging; Companies; International collaboration; Product development; Production; Speech; Technological innovation; Testing; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
978-0-7695-3117-5
Type
conf
DOI
10.1109/ISQED.2008.4479690
Filename
4479690
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