Title :
Noise Interaction Between Power Distribution Grids and Substrate
Author :
Andersson, Daniel A. ; Kristiansson, Simon ; Svensson, Lars J. ; Larsson-Edefors, Per ; Jeppson, Kjell O.
Author_Institution :
Chalmers Univ. of Technol., Gothenburg
Abstract :
We have investigated the interaction between power delivery and substrate coupling in terms of noise. From our results, we identify that an increased density of substrate contacts does not to any significance decrease noise on the power supply lines. However, the current injected into the substrate is highly dependent on higher-level grid/package inductance and substrate contact density. We have derived statistically that substrate noise variations could be related to these two design parameters to 69.75%. Based on linear fitting, a model that describes the injected current as function of substrate contact density and power delivery inductance is developed.
Keywords :
circuit simulation; inductance; integrated circuit modelling; integrated circuit noise; power supply circuits; integrated circuit noise; linear fitting; package inductance; power delivery inductance; power distribution grids; power supply lines; substrate contact density; substrate coupling; Contacts; Inductance; Integrated circuit interconnections; Integrated circuit noise; Noise generators; Packaging; Power distribution; Power grids; Power supplies; Power systems; Substrate noise; power supply;
Conference_Titel :
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
978-0-7695-3117-5
DOI :
10.1109/ISQED.2008.4479703
