Title :
Peak-to-peak switching noise and LC resonance on a power distribution TSV pair
Author :
Ahmad, Waqar ; Chen, Qiang ; Zheng, Li-Rong ; Tenhunen, Hannu
Author_Institution :
Dept. of Electron. & Comput. Syst., KTH R. Inst. of Technol., Stockholm, Sweden
Abstract :
How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
Keywords :
integrated circuit interconnections; integrated circuit noise; three-dimensional integrated circuits; IC interconnection; LC resonance; peak-to-peak switching noise; power distribution through silicon via pair; Capacitance; Inductance; Noise; Resistance; Three dimensional displays; Through-silicon vias; Transient analysis; 3D stack of ICs; LC resonance; peak-to-peak noise;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642574
