• DocumentCode
    3191782
  • Title

    Time-domain field responses of the thin, high-contrast, finely layered structure in IC packagings

  • Author

    De Hoop, Adrianus T. ; Jiang, Lijun

  • Author_Institution
    Lab. of Electromagn. Res., Math. & Comput. Sci., Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2010
  • fDate
    25-27 Oct. 2010
  • Firstpage
    233
  • Lastpage
    236
  • Abstract
    The thin, high-contrast, fine layers with dielectric and conductive properties, such as ground planes, are feature structures in IC packagings. Their responses to the pulsed electromagnetic field is important both theoretically and practically. In this paper, a new semi-analytical method is proposed to model the interaction of the layer with an incident electromagnetic field via a boundary condition that expresses the in-plane conduction and contrast electric polarization currents in terms of the exciting incident field by relating the jump in the tangential component of the magnetic field strength across the layer in terms of the (continuous) tangential component of the electric field strength in the layer. Expressions for pulse shapes of the reflected and transmitted fields are conveniently obtained based on this method. It provides a novel angle to investigate the ground plane effects inside IC packagings.
  • Keywords
    dielectric properties; electromagnetic fields; integrated circuit packaging; IC packagings; boundary condition; conductive properties; contrast electric polarization currents; dielectric properties; finely layered structure; ground planes; in-plane conduction; incident electromagnetic field; pulsed electromagnetic field; semi-analytical method; time-domain field responses; Boundary conditions; Dielectrics; Integrated circuit packaging; Scattering; Shape; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-6865-2
  • Electronic_ISBN
    978-1-4244-6866-9
  • Type

    conf

  • DOI
    10.1109/EPEPS.2010.5642586
  • Filename
    5642586