DocumentCode :
3191822
Title :
Improving high-speed SerDes performance using passive microwave filters along package traces
Author :
Bhandal, Amarjit S. ; Young, Brian
Author_Institution :
Custom BU Package Design, Texas Instrum., Northampton, UK
fYear :
2010
fDate :
25-27 Oct. 2010
Firstpage :
241
Lastpage :
244
Abstract :
Lab measurement and simulation results are presented to show how passive capacitive microwave filters along flip-chip package traces can be used to overcome the capacitive discontinuity at the output port of SerDes transceivers to improve link performance. The technique is further developed to demonstrate its ability to shape the near-end eye pattern to improve its height and/or jitter at different data rates up to 17Gbps. The benefits of the technique for devices which deploy many 10´s or 100´s of SerDes links are highlighted.
Keywords :
ball grid arrays; flip-chip devices; microwave filters; passive filters; transceivers; SerDes links; SerDes transceivers; capacitive discontinuity; flip-chip package traces; high-speed SerDes performance; lab measurement; passive capacitive microwave filters; Impedance; Jitter; Microwave circuits; Microwave filters; Microwave measurements; Substrates; Capacitive Discontinuity; FC-BGA Packaging; High-speed SerDes; Passive Microwave Filtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
Type :
conf
DOI :
10.1109/EPEPS.2010.5642588
Filename :
5642588
Link To Document :
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