Title :
Electrical and physical parametric study of high-speed link performance
Author :
Ki Jin Han ; Ritter, Mark B. ; Gu, Xiaoxiong
Author_Institution :
IBM Res., Yorktown Heights, NY, USA
Abstract :
This paper introduces an efficient environment for parametric and statistical studies of electrical link performance. With this simulation environment and its use of systematic input and output files, the effects of both physical and electrical design parameters can be readily observed. In addition, supported by fast electromagnetic and link simulators, the environment enables the extensive studies of electrical links by considering the effects of changing many design parameters. An exemplary parametric study in this paper shows the usefulness of the simulation environment for various future applications.
Keywords :
computational electromagnetics; electronics packaging; integrated circuit interconnections; printed circuit design; electrical link; electrical parameter; electromagnetic simulator; high speed link; link simulator; physical parameter; Channel models; Computational modeling; Data models; Decision feedback equalizers; Integrated circuit modeling; Packaging; Parametric study;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642589
