Title :
Constructing 3D package component broadband electrical models with correct DC values
Author :
Choi, Jinwoo ; Chen, Zhaoqing ; Becker, Wiren D. ; Morsey, Jason ; Rubin, Barry
Author_Institution :
IBM Syst. & Technol. Group, Austin, TX, USA
Abstract :
Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models extending to DC while retaining passivity and causality. The model derived by this method is suitable for transient simulations of packaging interconnect systems.
Keywords :
electronics packaging; frequency response; integrated circuit interconnections; 3D package component; broadband electrical models; causal models; channel simulations; correct DC values; frequency response; package interconnections; passive models; transient simulations; Connectors; Integrated circuit modeling; Mathematical model; Resistance; Scattering parameters; Solid modeling; Three dimensional displays; SerDes; causality; component; modeling; passivity;
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-6865-2
Electronic_ISBN :
978-1-4244-6866-9
DOI :
10.1109/EPEPS.2010.5642594
