• DocumentCode
    3192340
  • Title

    Process Variability Analysis in DSM Through Statistical Simulations and its Implications to Design Methodologies

  • Author

    STG, Srinivasa R. ; Srivatsava, Jandhyala ; Narahari Tondamuthuru, R.

  • Author_Institution
    Intel Technol. (I)(P) Ltd., Bangalore
  • fYear
    2008
  • fDate
    17-19 March 2008
  • Firstpage
    325
  • Lastpage
    329
  • Abstract
    Integrated circuit manufacturability in DSM is directly dependent on how well the manufacturing variations are accounted for during the design of circuits. This paper reviews the effect of various process variations in DSM especially systematic and random variations in three process generations 90 nm, 65 nm & 45 nm by doing SPICE simulation and analysis to look at the derating factors depending on the sensitivity to variations. Few individual standard cells are studied as apart of this exercise to see the effect of variation on their delays. Random variations are becoming a significant portion of the overall variations at 45 nm and below. The results suggests the need for selective, location based and variation aware analysis (SLVA) for the designs going forward.
  • Keywords
    SPICE; integrated circuit design; integrated circuit manufacture; manufacturing processes; nanoelectronics; statistical analysis; DSM; SPICE simulation; design methodologies; integrated circuit manufacturability; location based analysis; manufacturing variations; process variability analysis; random variations; selective analysis; statistical simulations; systematic variations; variation aware analysis; variation effect; Analytical models; Chemical analysis; Circuit simulation; Design methodology; Integrated circuit manufacture; Integrated circuit technology; Manufacturing processes; Process design; Semiconductor process modeling; Uncertainty; DSM; Design Methodologies; Random; Systematic; Variations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-0-7695-3117-5
  • Type

    conf

  • DOI
    10.1109/ISQED.2008.4479749
  • Filename
    4479749