Title :
Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers
Author :
Take, K. ; Furukawa, Y. ; Ushioda, S.
Author_Institution :
Res. & Dev., Showa Aluminum Corp., Tokyo, Japan
Abstract :
A roll bond heat pipe (RBHP) is very promising in the cooling of electronic equipment such as notebook computers. This study presents prediction data on maximum capillary limit obtained for the RBHP with 7.8 mm wide flow channel. Furthermore, experimental data on the thermal performance of the RBHP shows the temperature drop on the RBHP between the highest and lowest temperatures. These data determine the optimum working fluid charge volume and number of capillary loops for the RBHP
Keywords :
capillarity; cooling; electronic equipment testing; heat pipes; notebook computers; thermal analysis; 7.8 mm; capillary loops; cooling; electronic equipment; flow channel width; heat spreader plate; maximum capillary limit; notebook computers; optimum working fluid charge volume; prediction data; roll bond heat pipe; temperature drop; thermal performance; Aluminum; Bonding; Computer aided manufacturing; Contact resistance; Friction; Hydraulic diameter; Microcomputers; Permeability; Resistance heating; Temperature;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689610
