Title :
Advanced cooling system using miniature heat pipes in mobile PC
Author :
Nguyen, Fhang ; Mochizuki, Masataka ; Mashiko, Koichi ; Saito, Yuji ; Sauciuc, Loan ; Boggs, Rex
Author_Institution :
Fujikura Ltd., Tokyo, Japan
Abstract :
This paper describes various cooling solutions using heat pipes for cooling of notebook PCs including: (1) a heat pipe with heat spreader plate; (2) a hybrid system, i.e. a heat pipe with heat sink and fan; and (3) a hinged heat pipe system. For heat input of less than 12 W, the thermal resistances measured between the CPU surface and ambient are: >8°C/W for system (1) and 4-6°C/W for systems (2) and (3). This means that the hybrid system and the hinged heat pipe systems are the most suitable candidates for cooling of the current CPU, which may require heat dissipation of more than 8 W at ambient of 40°C and CPU maximum temperature of 95°C. Experimental results of these three systems are included and discussed in this paper
Keywords :
cooling; electronic equipment testing; heat pipes; heat sinks; integrated circuit packaging; microprocessor chips; notebook computers; thermal analysis; thermal resistance; 12 W; 40 C; 8 W; 95 C; CPU maximum temperature; CPU surface; ambient temperature; cooling; cooling system; fan; heat dissipation; heat input; heat pipe; heat pipes; heat sink; heat spreader plate; hinged heat pipe system; hybrid system; miniature heat pipes; mobile PC; notebook PCs; thermal resistance; Books; Containers; Cooling; Heat sinks; Heat transfer; Resistance heating; Surface resistance; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689612
