Abstract :
Conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the cover art, table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original conference proceedings.
Keywords :
CVD coatings; chemical mechanical polishing; copper; dielectric thin films; diffusion barriers; electroplating; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; 3D systems; Cu; Cu electrochemical plating; Cu low-k integration; Cu metallisation scaling; advanced CMP; advanced PVD/CVD barrier materials; interconnect system performance; low-k dielectrics; packaging; reliability; system on a chip;
