DocumentCode :
3193218
Title :
A Thermal-Friendly Load-Balancing Technique for Multi-Core Processors
Author :
Musoll, Enric
Author_Institution :
ConSentry Network, San Diego
fYear :
2008
fDate :
17-19 March 2008
Firstpage :
549
Lastpage :
552
Abstract :
In multi-core processors there are several ways to pair a thread to a particular core. These load-balancing techniques result in a quite different power, performance and thermal behavior of the processor, specially when low- power techniques like power gating are applied to the individual cores. In this work, a load-balancing technique that provides low overhead in performance and energy with respect to the highest performance case, yet featuring a smooth temperature distribution close to the optimal scenario is presented. An uneven temperature distribution leads to thermal hot spots which affect both the reliability of the processor (by stressing some parts of the die more than others), and the cost of the processor (since the package has to be designed to handle the worst hot spot).
Keywords :
integrated circuit design; microprocessor chips; thermal management (packaging); multicore processors; processor reliability; thermal behavior; thermal hot spots; thermal-friendly load-balancing technique; Cost function; Design optimization; Electronic packaging thermal management; Energy consumption; Multicore processing; Temperature distribution; Thermal loading; Thermal stresses; Tiles; Yarn; Multi-core architecture; hot spots; low power; power gating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
978-0-7695-3117-5
Type :
conf
DOI :
10.1109/ISQED.2008.4479794
Filename :
4479794
Link To Document :
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