• DocumentCode
    3193333
  • Title

    System-level design of a readout circuit with thermostatic control for a MEMS pellistor sensor

  • Author

    Leman, O. ; Srivastava, M. ; Hauer, J.

  • Author_Institution
    Dept. Integrated Circuits & Syst., Fraunhofer Inst. for Integrated Circuits IIS, Erlangen, Germany
  • fYear
    2015
  • fDate
    27-30 April 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Catalytic flammable gas sensors detect the presence of flammable gasses in air at a non-dangerous concentration level, thus helping in the prevention of explosion risks. These devices are usually operated without thermal control i.e. they measure the temperature increase of a detector induced by the catalytic combustion of the flammable gas. We propose the system-level design of a bias and readout system that directly measures the heat produced by the catalytic combustion. The proposed solution operates the sensor at a constant temperature via a feedback scheme that contains two thermal feedback loops. We chose a feedback control that uses pulse-density modulation, thus the proposed system implements a direct analog-to-digital conversion of the heat produced by the catalytic combustion. In practice, this mixed-signal front-end for pellistors is expected to extend the functionality and precision of the sensor while providing with a simple implementation.
  • Keywords
    analogue-digital conversion; combustion; feedback; gas sensors; microsensors; pulse modulation; readout electronics; MEMS pellistor sensor; catalytic combustion; catalytic flammable gas sensors; direct analog-to-digital conversion; explosion risks prevention; feedback control; feedback scheme; mixed-signal front-end; pulse-density modulation; readout system; thermostatic control; two thermal feedback loops; Bridge circuits; Clocks; Gas detectors; Heating; Modulation; Resistors; Temperature sensors; MEMS; calorimetric gas sensor; catalytic combustion; pellistor; pulse-density modulation; sigma-delta modulator; thermal feedback;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
  • Conference_Location
    Montpellier
  • Print_ISBN
    978-1-4799-8627-9
  • Type

    conf

  • DOI
    10.1109/DTIP.2015.7160976
  • Filename
    7160976