DocumentCode :
3193333
Title :
System-level design of a readout circuit with thermostatic control for a MEMS pellistor sensor
Author :
Leman, O. ; Srivastava, M. ; Hauer, J.
Author_Institution :
Dept. Integrated Circuits & Syst., Fraunhofer Inst. for Integrated Circuits IIS, Erlangen, Germany
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
6
Abstract :
Catalytic flammable gas sensors detect the presence of flammable gasses in air at a non-dangerous concentration level, thus helping in the prevention of explosion risks. These devices are usually operated without thermal control i.e. they measure the temperature increase of a detector induced by the catalytic combustion of the flammable gas. We propose the system-level design of a bias and readout system that directly measures the heat produced by the catalytic combustion. The proposed solution operates the sensor at a constant temperature via a feedback scheme that contains two thermal feedback loops. We chose a feedback control that uses pulse-density modulation, thus the proposed system implements a direct analog-to-digital conversion of the heat produced by the catalytic combustion. In practice, this mixed-signal front-end for pellistors is expected to extend the functionality and precision of the sensor while providing with a simple implementation.
Keywords :
analogue-digital conversion; combustion; feedback; gas sensors; microsensors; pulse modulation; readout electronics; MEMS pellistor sensor; catalytic combustion; catalytic flammable gas sensors; direct analog-to-digital conversion; explosion risks prevention; feedback control; feedback scheme; mixed-signal front-end; pulse-density modulation; readout system; thermostatic control; two thermal feedback loops; Bridge circuits; Clocks; Gas detectors; Heating; Modulation; Resistors; Temperature sensors; MEMS; calorimetric gas sensor; catalytic combustion; pellistor; pulse-density modulation; sigma-delta modulator; thermal feedback;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7160976
Filename :
7160976
Link To Document :
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