DocumentCode
3193478
Title
Accelerating Clock Mesh Simulation Using Matrix-Level Macromodels and Dynamic Time Step Rounding
Author
Ye, Xiaoji ; Zhao, Min ; Panda, Rajendran ; Li, Peng ; Hu, Jiang
Author_Institution
Texas A&M Univ., College Station
fYear
2008
fDate
17-19 March 2008
Firstpage
627
Lastpage
632
Abstract
Clock meshes have found increasingly wide applications in today´s high-performance IC designs. The inherent routing redundancies associated with clock meshes lead to improved clock skews and reliability. However, the high complexity of clock meshes in modern chip designs has made its verification very challenging. A typical clock distribution network may consist of millions of coupled/interconnected linear elements and hundreds of nonlinear clock drivers attached at different locations on the mesh. Such a large network is often too complex for feasible SPICETike simulation. In this paper, we present a new simulation methodology which decomposes a clock mesh into linear and nonlinear parts. By exploiting the special matrix property of the linear subsystem resulting from modified nodal analysis (MNA) formulation, the linear subsystem is represented as a matrix-level macromodel, which greatly simplifies the overall simulation task. These macromodels can be efficiently computed using Cholesky factorization and significantly speedup the nonlinear Newton-Raphson iterations used in the transient simulation for the complete clock mesh. Furthermore, a dynamic time step rounding technique is proposed to limit the number of passive macromodels needed in the entire transient simulation which further improves the efficiency of the proposed approach.
Keywords
Newton-Raphson method; clocks; integrated circuit design; integrated circuit modelling; synchronisation; Cholesky factorization; clock mesh simulation; clock skew; dynamic time step rounding; matrix-level macromodel; nodal analysis formulation; nonlinear Newton-Raphson iteration; nonlinear part; passive macromodel; transient simulation; Acceleration; Analytical models; Application specific integrated circuits; Chip scale packaging; Clocks; Computational modeling; Couplings; Matrix decomposition; Redundancy; Routing; clock mesh; dynamic time step rounding; macromodel; simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2008. ISQED 2008. 9th International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
978-0-7695-3117-5
Type
conf
DOI
10.1109/ISQED.2008.4479810
Filename
4479810
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