Inductive effects on crosstalk evaluation

Author

Servel, G. ; Huret, F. ; Paleczny, E. ; Legier, J.F. ; Deschacht, D.

Author_Institution

CNRS, Montpellier, France

fYear

2001

fDate

6-6 June 2001

Firstpage

63

Lastpage

65

Abstract

Coupling noise between adjacent interconnect lines has become more significant in deep submicron technologies. From an electromagnetic analysis, this coupling noise is determined with respect to the different parameters and a comparison is made between distributed RC and RLC models to represent the interconnection. It is shown that the inductive effects cannot be neglected and a corrective term is proposed to improve the accuracy of the RC model. Our analytical expression is validated through the different parameters involved.

Keywords

VLSI; crosstalk; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; adjacent interconnect lines; coupling noise; crosstalk evaluation; deep submicron technologies; distributed RC models; distributed RLC models; electromagnetic analysis; inductive effects; Coupling circuits; Crosstalk; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic modeling; Impedance; Integrated circuit interconnections; Integrated circuit technology; RLC circuits; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International

Conference_Location

Burlingame, CA, USA

Print_ISBN

0-7803-6678-6

Type

conf

DOI

10.1109/IITC.2001.930018

Filename

930018