Title :
Inductive effects on crosstalk evaluation
Author :
Servel, G. ; Huret, F. ; Paleczny, E. ; Legier, J.F. ; Deschacht, D.
Author_Institution :
CNRS, Montpellier, France
Abstract :
Coupling noise between adjacent interconnect lines has become more significant in deep submicron technologies. From an electromagnetic analysis, this coupling noise is determined with respect to the different parameters and a comparison is made between distributed RC and RLC models to represent the interconnection. It is shown that the inductive effects cannot be neglected and a corrective term is proposed to improve the accuracy of the RC model. Our analytical expression is validated through the different parameters involved.
Keywords :
VLSI; crosstalk; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; adjacent interconnect lines; coupling noise; crosstalk evaluation; deep submicron technologies; distributed RC models; distributed RLC models; electromagnetic analysis; inductive effects; Coupling circuits; Crosstalk; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic modeling; Impedance; Integrated circuit interconnections; Integrated circuit technology; RLC circuits; Voltage;
Conference_Titel :
Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-6678-6
DOI :
10.1109/IITC.2001.930018
