Title :
Nonlinear thermal analysis of a rectangular diamond IIa heat spreader used for microwave power devices
Author :
Hui, P. ; Tan, H.S.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Abstract :
We present a nonlinear thermal analysis for a rectangular diamond IIa heat spreader used for microwave power devices. The Kirchhoff transformation is used to take account of temperature dependent thermal conductivity. We point out what we believe to be errors in an analytical approach applied to the same problem published by Batchelor and Postoyalko (Proc. Roy. Soc. London, vol. A445, p.375, 1995). A comparison study with the case of circular spreaders indicates that for the same spreader thickness and cross-sectional area, a 2D circular model can be used to obtain the upper limit of the thermal behaviour for square spreaders within 3% errors
Keywords :
diamond; error analysis; microwave diodes; power semiconductor diodes; thermal analysis; thermal conductivity; thermal management (packaging); transforms; 2D circular model; C; Kirchhoff transformation; circular spreaders; microwave power devices; microwave power diodes; nonlinear thermal analysis; rectangular diamond IIa heat spreader; spreader cross-sectional area; spreader thickness; square spreaders; temperature dependent thermal conductivity; thermal behaviour; Boundary conditions; Diodes; Electromagnetic heating; Heat sinks; Heat transfer; Microwave devices; Packaging; Temperature dependence; Thermal conductivity; Waste heat;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689615