Title :
Characterization and simulation of signal propagation and crosstalk on advanced Cu-SiO/sub 2/ on-chip interconnects for high speed circuits
Author :
Bermond, Cedric ; Flechet, Bernard ; Arnal, Vincent ; Farcy, Alexis ; Torres, Joaquin ; Morand, Yves ; Le Carval, Gilles ; Charlet, Francois ; Angenieux, Gilbert
Author_Institution :
Savoie Univ., Le Bourget du Lac, France
Abstract :
Electrical high-speed signal characterization and simulation are presented for Cu-SiO 2 on-chip wiring structure. Propagation constant, characteristic impedance and R, L, C, G matrices are extracted from frequency measurements in a whole spectrum and compared to values obtained by EM modeling. Very good agreement is reported between measured and simulated signals for propagation and crosstalk waveforms. Next, from previous results, high-speed signal propagation along interconnects is simulated to investigate electrical performances as a function of design. The impact of copper wiring, low k-dielectrics and geometry on electrical performance in terms of signal propagation and crosstalk level are studied.
Keywords :
VLSI; copper; crosstalk; dielectric thin films; high-speed integrated circuits; integrated circuit interconnections; integrated circuit measurement; silicon compounds; Cu wiring; Cu-SiO/sub 2/; Cu-SiO/sub 2/ onchip interconnects; characteristic impedance; crosstalk; frequency measurements; high speed circuits; high-speed signal characterization; low k-dielectrics; matrices; onchip wiring structure; propagation constant; signal propagation; simulation; Circuit simulation; Copper; Crosstalk; Frequency measurement; Geometry; Impedance; Integrated circuit interconnections; Propagation constant; Signal design; Wiring;
Conference_Titel :
Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-6678-6
DOI :
10.1109/IITC.2001.930030
